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Historically, sectors such as the electronics, medical and micromechanics industries have been pioneers in the area of miniaturisation. Read more

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Precision positioning technology has evolved continuously over recent decades and is now becoming increasingly intelligent; Read more

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Advances in lithographic processing are allowing for the production of ever smaller semiconductor devices, but nanometre-sized defects on wafer substrates can limit the performance of such devices. Read more

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Laser-based tools overcome many of the challenges presented by the increasingly complex interconnects (redistribution layers (RDLs), copper bumps and pillars, etc.) and ever thinner wafers utilised in stacked 2.5D, 3D and fan-out packages. Read more

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