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Pushing the Boundaries of Laser-Processed Micro Cutting Tools
Historically, sectors such as the electronics, medical and micromechanics industries have been pioneers in the area of miniaturisation. Read more
Intelligent active alignment lowers the manufacturing costs of optical and photonic systems
Precision positioning technology has evolved continuously over recent decades and is now becoming increasingly intelligent; Read more
Detecting and classifying defects in semiconductor manufacturing via automatic defect review with atomic force microscopy
Advances in lithographic processing are allowing for the production of ever smaller semiconductor devices, but nanometre-sized defects on wafer substrates can limit the performance of such devices. Read more
Excimer lasers are propelling advanced package integration for the 5G mobile revolution
Laser-based tools overcome many of the challenges presented by the increasingly complex interconnects (redistribution layers (RDLs), copper bumps and pillars, etc.) and ever thinner wafers utilised in stacked 2.5D, 3D and fan-out packages. Read more