mems
Features
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announces it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding Read more
New Miniature Atomic Watches Will Soon Hit the Market
The EU-funded macQsimal project, coordinated by CSEM as part of the EU’s FET Flagship on Quantum Technologies program, has now drawn to a close, after leading to some promising discoveries. Read more
EV Group Earns Outstanding 10th Consecutive Triple Crown Win in TechInsights 2022 Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, Read more
EV Group Lithography Solutions for Heterogeneous Integration and Wafer-level Packaging
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More than Moore” applications Read more