mems
Features
New MEMS Pirani Vacuum Transducer
Posifa Technologies introduces its new PVC4000 series MEMS Pirani vacuum transducer. Designed for cost-effective OEM integration, the device consists of a surface-mount MEMS Pirani sensor and microcontroller-based measuring electronics Read more
New Way to Use Graphene in Semiconductor Manufacturing
Graphene Flagship researchers have reported a new method to integrate graphene and 2D materials into semiconductor manufacturing lines, a milestone for the initiatives recently launched Read more
New Hybrid Die-to-Wafer Bonding Activation Solution from EV Group
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG's equipment portfolio for end-to-end hybrid bonding for 3D/Heterogeneous Integration Read more
Inseto Provides Even Greater Technical Support
Chris Valentine appointed to help Inseto’s valued customers further de-risk their semiconductor and MEMS fabrication projects. Read more