Bruker has announced the release of the Dektak XTL Stylus Profiler, extending its industry-leading stylus profilometry capabilities to 200 and 300 millimeter semiconductor wafer fabs and next-generation touch panel manufacturers. The system provides the most cost- effective, full 300-millimeter wafer solution for characterizing thin film step heights, resist step heights, line edge roughness, CMP dishing and erosion, as well as roll off amount (ROA). The Dektak XTL combines decades of stylus innovation with new features targeting QA/QC environments to enable increased accuracy and minimal operator intervention between loading and unloading samples.
“Bruker’s Dektak XTL with a 12-inch stage is the most advanced system in its class,” said Roger Lee, Integration Department Project Director for China Wafer Level CSP Co., Ltd. (WLCSP). “The system is stable and reliable, and it incorporates many powerful functionalities and ease-of-use features. Bruker’s stylus profilers always lead the industry in technology, and they always meet our metrology requirements in production.”
“Customers like WLCSP have been asking for a larger scale stylus measurement system to support their latest 300 mm wafer factory needs with the accuracy and industry-proven repeatability of our traditional Dektak products,” added Kent Heath, General Manager of Bruker’s Stylus and Optical Metrology business unit. “With the Dektak XTL we have delivered on this need with its 5 nanometer repeatability, and we have built-in a new level of point-and-click automation for maximum productivity that is unrivaled in the industry. Our early access customers have been amazed by how intuitive it is to use for production and development applications.”