Bruker has announced that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capable ContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led to over $5 million in orders by several leading HDI/MCM PCB manufacturers.
“Demand for Bruker’s fifth generation SP model continues to build as early adoption customers enjoy the advanced capabilities and ease of use offered by the ContourSP,” said Mark R. Munch, Ph.D., President of the Bruker MAT Group. “By doubling the throughput and adding new proprietary measurement capabilities, our customers are able to achieve maximum productivity in this era of ever smaller line widths and tighter tolerances in the PCB industry.”
“Not only is the ContourSP much faster than other systems at performing these precise measurements, but we’ve added a number of productivity enhancing features,” added Kent Heath, Senior Director of Marketing for Bruker’s Stylus and Optical Business. “The new Vision64® operator interface with multi-processing features multi-region analysis, automatic re-measurement, and our proprietary Dynamic Signal Segmentation (DSS) analysis, making the ContourSP the most comprehensive tool available.”