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The new microMIRA excimer laser lift-off system from 3D-Micromac provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds.
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The microMIRA system can be used for device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as organic light emitting diode (OLED) and microLED display manufacturing.
3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, has received an order for the company's new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-resolution digital sensors. The microMIRA system will be shipped to dpiX's fab in Colorado Springs, Colo., where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing X-ray sensors for medical, industrial and military applications.
3D-Micromac's new microMIRA laser lift-off system provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds (up to 500 wafers/hour and up to 200 sheets/hour on Gen 6 substrates depending on the application). The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer's unique requirements.
The microMIRA system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as organic light emitting diode (OLED) and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification, including printed electronics such as near-field communication (NFC) sensors and tags.
"In evaluating various laser approaches for our manufacturing needs, 3D-Micromac's microMIRA laser lift-off system provided the best possible combination of cost of ownership, throughput and uniformity results," stated Frank Caris, President and CEO of dpiX. "We look forward to installing this system in our production fab for use in manufacturing our latest silicon-based X-ray sensor arrays."
In addition to its high configurability, speed and uniformity, 3D-Micromac's microMIRA laser lift-off system provides many other benefits, including:
- Force-free and extremely selective laser processing
- No damage due to thermo-mechanical effects
- Low production costs, including the ability to recycle/reuse carrier substrates
- Elimination of costly and polluting wet chemical processes
- Easy integration of adjacent manufacturing steps for greater fab productivity
"Our new microMIRA laser lift-off system takes advantage of the extensive process and applications knowledge we have built up from the more than 400 3D-Micromac laser systems installed and in use worldwide to date, including dozens of excimer laser systems used for display and microelectronics manufacturing," stated Uwe Wagner, 3D-Micromac's chief technology officer. "We look forward to closer engagement with dpiX to explore new opportunities and applications that can benefit from our laser products, processes and expertise."
3D-Micromac will showcase its suite of laser processing systems for display manufacturing, including the new microMIRA laser lift-off system, at the 55th SID International Symposium, Seminar and Exhibition, also known as Display Week 2018, being held May 20-25 at the Los Angeles Convention Center. Attendees interested in learning more about these products are invited to visit the company's booth #631. More information on microMIRA can also be found at http://3d-micromac.com/laser-micromachining/products/micromira-laser-lift-off-system/.