LPKF Laser & Electronics AG’s exhibit at Stand 428 in Hall 6 is well worth a visit. The material micromachining specialist will present its latest processes for close-to-production PCB prototyping without chemical etching. The complete line for simple and efficient PCB prototyping will be shown. The latest generation of the proven circuit board plotters and the professional SMT assembly line (stencil printer, manual assembler, and reflow oven) can produce PCBs with one, two or more layers in just one day.
Britta Schulz, Vice President Rapid PCB Prototyping, says, “It’s worth a visit, not only because of the systems on show. The consultants at the stand are proven system and application specialists experienced in solving practical problems.”
The latest LPKF ProtoLaser U3 can be used for structuring laminated substrates as well as cutting and drilling. It offers a wide range of applications and materials. Thanks to its ceramic machining, ITO/TCO structuring, and LTCC machining capabilities, it has become a standard tool for universities and R&D laboratories.
LPKF will also present the LPKF MicroLine 1820 P UV laser cutting system at the main stand (H6/428). Based on the compact UV laser cutting systems of the Microline-1000 line, it has a stronger laser source, faster dynamic components, and an optional safety partition. Therefore it is recommended for rapid UV machining of thin, flexible conductor materials or cover layers with fast cycle times.
Another UV laser cutting system can be seen in action on the “Future Packaging” production line at the IZM joint stand (Hall 6, Stand 434A). The LPKF MicroLine 6000 S is especially equipped for integration into production lines. The exhibition model features new properties. Position correction offsets deviations in the laser beam by means of active elements in the optical path. This reduces environmental influences in the machining and ensures continuously high precision. The LPKF MicroLine 6000 S cuts assembled boards out of a panel without mechanically or dynamically loading the delicate structures or components.
LPKF will also take part in the 3D-MID joint exhibition stand (Stand 810A in Hall 7) with the LPKF Fusion3D 1500 laser structuring system on the 3D-MID production line. With this low-cost laser system, injection-molded plastic parts with lengths of up to 40 centimeters can be structured using the LDS process. The LPKF ProtoPlate LDS will also be presented to show how a subsequent metallization process can be used to turn simple plastic components into high-quality 3D circuit substrates.