ZEISS introduces the next generation of photomask qualification system AIMS 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. ZEISS has experience in aerial imaging technology and AIMS for more than 20 years and has become a defacto-industry standard for printability analysis of mask defects. The new system supports the further extension of 193nm lithography and meets the challenging requirements of advanced lithography techniques such as Multi-Patterning and Source Mask Optimization.
AIMS enables the user to qualify the optical performance of a mask under scanner equivalent illumination conditions. The AIMS 1x-193i works with 193nm illumination and benefits from a completely redesigned optical system. By utilising FlexIllu it provides the highest level of illumination flexibility as it is able to read the scanner files for illumination. FlexIllu sets the scanner illumination settings computer controlled.
Thanks to the advances in the optical design as well as major improvements in the software the AIMS 1x-193i achieves significantly reduced turnaround-times. The enhanced pupil uniformity realizes best scanner and tool-to-tool matching.
Another highlight is a significantly improved CD repeatability enabling more accurate defect qualification that stays ahead of the requirements of the ITRS roadmap as the industry moves to smaller feature sizes.
“The total number as well as the complexity of masks increases with every node due to Multi-Patterning techniques and complex mask designs. AIMS 1x-193 matches the tight requirements of high-end mask makers in terms of accuracy, efficiency and cycle time,” states Ute Buttgereit, Senior Product Manager AIMS.
The first tool has achieved excellent results during customer acceptance procedure and was shipped to their facility. To maintain the high performance and productivity demanded by leading-edge customers, the AIMS 1x-193i systems are supported by ZEISS´ global comprehensive service network.