CEA Leti

Leti, a research institute of CEA Tech, has announced it has created the world’s first micro fluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider. more

Dec 12, 2017 12:12 PM electronics

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

Nov 30, 2017 4:14 PM mems

Leti, a research institute of CEA Tech, has announced a new European Horizon 2020 project to develop innovative electric drivetrains for third-generation electric vehicles. more

Nov 13, 2017 4:09 PM electronics

Leti has announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI). more

Sep 7, 2017 5:31 PM electronics

Extending its expertise in high-brightness micro display technology for augmented-reality and other applications, Leti will demonstrate the world’s first wide video graphic array (WVGA) GaN micro display with 10-micron pixel pitch during Display Week more

May 26, 2017 5:06 PM electronics

Middleware Collects, Aggregates and Secures Scripting of Data from Multiple Devices via Virtually Any IoT Communication Protocol. more

Mar 23, 2017 5:18 PM electronics

Leti has developed a μLED fabrication process for high-resolution arrays at 10-micron pitch. more

Feb 8, 2017 10:40 AM electronics

Leti CEO Marie Semeria will help kick off IEDM 2016 with an opening-day keynote address on Monday, Dec. 5, titled “Symbiotic Low-Power, Smart and Secure Technologies in the Age of Hyperconnectivity”. more

Nov 22, 2016 10:44 AM electronics

Leti has announced it has joined the Stanford SystemX Alliance. more

Oct 7, 2016 10:15 AM micro manufacturing

Three Grenoble-based research and medical partners have been selected to join the European Union-funded IDentIFY project to significantly extend the capability of magnetic resonance imaging (MRI) in disease detection. more

Jun 21, 2016 5:38 PM micro manufacturing

Will Work with Leti, STMicroelectronics and Mentor Graphics to Develop Advanced 3D Die-to-wafer Stacking Technologies Using Direct Cu-Cu Bonding more

Jan 18, 2016 5:44 PM mems

CEA-Leti has announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300 mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power. more

Jul 14, 2015 5:36 PM mems

IRT Nanoelec and CEA-Leti, STMicroelectronics and Mentor Graphics have realised an innovative 3D chip called “3DNoC”. more

Jul 9, 2015 3:55 PM mems

CEA-Leti will highlight advanced technologies during SEMICON West in San Francisco, USA, on 8-10 July. more

Jun 25, 2014 4:33 PM mems

CEA-Leti is hosting its sixth workshop on innovative memory technologies at MINATEC on Tuesday, June 24, 2014, Grenoble, France. more

Jun 12, 2014 4:38 PM mems

A year after announcing the industrialization of CEA-Leti’s M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of 6DOF MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die. more

Feb 24, 2014 4:53 PM mems

CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density. more

Oct 25, 2013 11:34 AM

CEA-Leti said that its multi-partner programmes, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193 nm immersion lithography for 1X nodes. more

Jul 30, 2013 12:47 PM mems

CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimise temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures. more

Jul 25, 2013 2:44 PM

CEA-Leti has announced that Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently completed HELIOS program. more

May 15, 2013 5:00 PM mems