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CEA Leti

Leti, Transdev and IRT Nanoelec announce a pilot program to characterize and assess LiDAR sensors to improve performance and safety of autonomous vehicles. more

electronics

Leti, a research institute of CEA Tech, has announced it has created the world’s first micro fluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider. more

electronics

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

mems

Leti, a research institute of CEA Tech, has announced a new European Horizon 2020 project to develop innovative electric drivetrains for third-generation electric vehicles. more

electronics

Leti has announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI). more

electronics

Extending its expertise in high-brightness micro display technology for augmented-reality and other applications, Leti will demonstrate the world’s first wide video graphic array (WVGA) GaN micro display with 10-micron pixel pitch during Display Week more

electronics

Middleware Collects, Aggregates and Secures Scripting of Data from Multiple Devices via Virtually Any IoT Communication Protocol. more

electronics

Leti has developed a μLED fabrication process for high-resolution arrays at 10-micron pitch. more

electronics

Leti CEO Marie Semeria will help kick off IEDM 2016 with an opening-day keynote address on Monday, Dec. 5, titled “Symbiotic Low-Power, Smart and Secure Technologies in the Age of Hyperconnectivity”. more

electronics

Leti has announced it has joined the Stanford SystemX Alliance. more

micro manufacturing

Three Grenoble-based research and medical partners have been selected to join the European Union-funded IDentIFY project to significantly extend the capability of magnetic resonance imaging (MRI) in disease detection. more

micro manufacturing

Will Work with Leti, STMicroelectronics and Mentor Graphics to Develop Advanced 3D Die-to-wafer Stacking Technologies Using Direct Cu-Cu Bonding more

mems

CEA-Leti has announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300 mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power. more

mems

IRT Nanoelec and CEA-Leti, STMicroelectronics and Mentor Graphics have realised an innovative 3D chip called “3DNoC”. more

mems

CEA-Leti will highlight advanced technologies during SEMICON West in San Francisco, USA, on 8-10 July. more

mems

CEA-Leti is hosting its sixth workshop on innovative memory technologies at MINATEC on Tuesday, June 24, 2014, Grenoble, France. more

mems

A year after announcing the industrialization of CEA-Leti’s M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of 6DOF MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die. more

mems

CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density. more

CEA-Leti said that its multi-partner programmes, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193 nm immersion lithography for 1X nodes. more

mems

CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimise temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures. more