CEA-Leti has announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300 mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power. more

Jul 14, 2015 5:36 PM mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

Oct 8, 2014 4:52 PM mems

A University of Glasgow spinout company which has developed technology to tackle the increasing challenges of silicon chip development has signed a multimillion dollar deal with a major semiconductor foundry. more

Jul 24, 2014 4:58 PM mems

Research and Markets has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. more

Jul 16, 2014 10:26 AM mems

Plasma-Therm and Smoltek have entered a partnership to develop carbon-based growth and device technologies. more

Jun 25, 2013 12:21 PM mems

CEA-Leti has announced that Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently completed HELIOS program. more

May 15, 2013 5:00 PM mems