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electronics

With the UAI 1206, SCHURTER offers a pulse and temperature resistant chip fuse with slow release characteristics for applications in which aging resistance and maximum reliability have the highest priority. Read more

electronics

Leti, a research institute of CEA-Tech, and Silvaco Inc., a leading global provider of software, IP and services for designing chips and electronic systems for semiconductor companies Read more

electronics

A servo drive small enough to fit on, or inside, a moving load, yet capable of delivering over 10,000w of qualitative power, is being showcased by Elmo Motion Control at this year’s Engineering Design Show Read more

electronics

Inseto, a leading technical distributor of equipment and materials, and DELO, a leading manufacturer of industrial adhesives, are celebrating 20 years of partnership during which meeting customers’ needs has, and remains, an unwavering top-priority. Read more

electronics

The distributed force array (DFA) sensor uses Peratech’s proprietary quantum tunnelling composite (QTC) technology Read more

electronics

Imec, the research and innovation hub in nano-electronics and digital technology, announces that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level. Read more

electronics

Bedlington facility receives investment to support anticipated growth Read more

electronics

The BMP388 is ideally suited for altitude tracking in Consumer Electronics (CE) drones, wearables, smart homes and other applications. Read more

mems

Hosted by SEMI Europe, the ISS Europe 2018 is the three-day flagship business event that brings together leading analysts, researchers, economists, and technologists for critical insights on the forces shaping the electronics manufacturing supply cha Read more

electronics

Bosch Sensortec launches the MEMS sensor BMI088, a high-performance Inertial Measurement Unit (IMU) with outstanding vibration robustness, specifically designed for drone and robotics applications. Read more

mems

Rehm relies on the new YXLON Cheetah μHD with 3D computer tomography (CT) for components analysis. Read more

electronics

The Fraunhofer FEP together with the Fraunhofer Institute for Machine Tools and Forming Technology IWU, have merged their expertise in order to advance a new generation of medical implants. Read more

electronics

New, high power ultraviolet and green additions to Coherent’s popular AVIA industrial nanosecond laser family extend and improve the performance of microprocessing applications in microelectronics, photovoltaics and related industries. Read more

lasers

On July 5 and 6, 2017 the city of Dortmund in Germany turned into a hub for miniaturised and individualised medicine. Read more

events

HMD Global, the home of Nokia phones, and ZEISS have jointly announced the signing of an exclusive partnership that aims to set new imaging standards within the smartphone industry. Read more

electronics

Astute Electronics Ltd, franchised global distributor and procurement specialist, announces the Eclipse hybrid power connector from Positronic, a leading manufacturer of power connectors. Read more

electronics

Governments and industry stakeholders are keenly following developments in the microelectronics industry, as these technologies could potentially disrupt and bolster the Internet of Things (IoT) Mega Trend. Read more

electronics

Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP presents a high-resolution fingerprint-sensor at SID Display Week 2017, on 23-25 May 2017 in Los Angeles/USA. Read more

electronics

A new technique using liquid metals to create integrated circuits that are just atoms thick could lead to the next big advance for electronics. Read more

electronics

Connector manufacturers are turning to more affordable H-Pins over traditional pogo-style options without sacrificing performance Read more

electronics