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EV Group (EVG)

EVG120 resist processing system released on enhanced tool platform that enables greater performance, throughput and reliability. more

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EVG has announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. more

electronics

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

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First-of-its-kind solution combines high resolution and 3D printing capabilities of SwissLitho NanoFrazor system with high throughput and cost-effectiveness of EVG's SmartNIL technology. more

electronics

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

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EVG Technology Day Event in Yokohama Highlights Process Solutions Supporting Internet of Things (IoT) Applications. more

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EVG combines solid-state UV laser, proprietary optics, modular platform and universal debonding process to create high-throughput, low cost-of-ownership debonding process optimized for FoWLP. more

lasers

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

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EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers. more

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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to expand production capacity in Austria more

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Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors. more

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EVG leverages more than 15 years of experience in biotech R&D and industry-proven substrate bonding and lithography solutions and expertise to support next-generation biotechnology device manufacturing. more

electronics

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG's leadership in fusion and hybrid bonding. more

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EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

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SmartNIL large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. more

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EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

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EV Group has unveiled the GEMINI FB XT, its next-generation fusion wafer bonding platform. more

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New subsidiary to enhance service and support for the rapidly expanding micro and nano electronic manufacturing customer base in the region. more

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CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimise temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures. more

EVG, a leading supplier of wafer bonding and lithography equipment for the MEMS, nano technology and semiconductor markets, has introduced the latest version of its EVG120 automated resist processing system. more

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