EV Group (EVG)

EVG has announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. more

Dec 20, 2017 10:31 AM electronics

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

Nov 30, 2017 4:14 PM mems

First-of-its-kind solution combines high resolution and 3D printing capabilities of SwissLitho NanoFrazor system with high throughput and cost-effectiveness of EVG's SmartNIL technology. more

Nov 1, 2017 10:45 AM electronics

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

Oct 3, 2017 11:14 AM mems

EVG Technology Day Event in Yokohama Highlights Process Solutions Supporting Internet of Things (IoT) Applications. more

Aug 3, 2017 12:20 PM mems

EVG combines solid-state UV laser, proprietary optics, modular platform and universal debonding process to create high-throughput, low cost-of-ownership debonding process optimized for FoWLP. more

Jul 21, 2017 11:10 AM lasers

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

Jun 29, 2017 5:28 PM mems

EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers. more

Jun 23, 2017 9:10 AM mems

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to expand production capacity in Austria more

Jun 1, 2017 2:43 PM mems

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors. more

May 22, 2017 1:08 PM mems

EVG leverages more than 15 years of experience in biotech R&D and industry-proven substrate bonding and lithography solutions and expertise to support next-generation biotechnology device manufacturing. more

Oct 21, 2016 12:26 PM electronics

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG's leadership in fusion and hybrid bonding. more

May 12, 2016 4:53 PM mems

EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

Dec 1, 2014 4:48 PM mems

SmartNIL large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. more

Oct 29, 2014 5:04 PM mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

Oct 8, 2014 4:52 PM mems

EV Group has unveiled the GEMINI FB XT, its next-generation fusion wafer bonding platform. more

Jul 3, 2014 3:39 PM mems

New subsidiary to enhance service and support for the rapidly expanding micro and nano electronic manufacturing customer base in the region. more

Mar 19, 2014 11:22 AM mems

CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimise temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures. more

Jul 25, 2013 2:44 PM

EVG, a leading supplier of wafer bonding and lithography equipment for the MEMS, nano technology and semiconductor markets, has introduced the latest version of its EVG120 automated resist processing system. more

May 10, 2013 12:25 PM mems 1 Comments

EV Group (EVG) has announced that it has installed a fully automated 300-mm system from EVG's Gemini product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. more

Mar 18, 2013 2:09 PM mems