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lithography

Veeco Instruments Inc. has announced it has received an order for its new Lancer Ion Beam Etch (IBE) System from a leading Japanese technology company. more

electronics

First-of-its-kind solution combines high resolution and 3D printing capabilities of SwissLitho NanoFrazor system with high throughput and cost-effectiveness of EVG's SmartNIL technology. more

electronics

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

mems

EVG Technology Day Event in Yokohama Highlights Process Solutions Supporting Internet of Things (IoT) Applications. more

mems

EVG combines solid-state UV laser, proprietary optics, modular platform and universal debonding process to create high-throughput, low cost-of-ownership debonding process optimized for FoWLP. more

lasers

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

mems

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG's leadership in fusion and hybrid bonding. more

mems

EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

mems

SmartNIL large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. more

mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

mems

A plant for the production of electronic optical elements using MEMS technology has been launched at the Moscow Technopolis. more

mems

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. more

lasers

EV Group has unveiled the GEMINI FB XT, its next-generation fusion wafer bonding platform. more

mems

ZEISS introduces the next generation of photomask qualification system AIMS 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. more

machining

A new lithography process makes it possible to pack even more transistors on a chip. The TRUMPF Laser Amplifier delivers the high-energy pulses needed to do so. more

lasers

The Semiconductor Manufacturing Technology business group at Carl Zeiss and the German national metrology institute PTB will be expanding their cooperation in the future to include optics metrology for EUV lithography. more

metrology

The "Lithography for the 22 nanometer node" project, led by Carl Zeiss, has been successfully completed. more

mems