Veeco Instruments Inc. has announced it has received an order for its new Lancer Ion Beam Etch (IBE) System from a leading Japanese technology company. more

Nov 23, 2017 9:13 AM electronics

First-of-its-kind solution combines high resolution and 3D printing capabilities of SwissLitho NanoFrazor system with high throughput and cost-effectiveness of EVG's SmartNIL technology. more

Nov 1, 2017 10:45 AM electronics

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

Oct 3, 2017 11:14 AM mems

EVG Technology Day Event in Yokohama Highlights Process Solutions Supporting Internet of Things (IoT) Applications. more

Aug 3, 2017 12:20 PM mems

EVG combines solid-state UV laser, proprietary optics, modular platform and universal debonding process to create high-throughput, low cost-of-ownership debonding process optimized for FoWLP. more

Jul 21, 2017 11:10 AM lasers

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

Jun 29, 2017 5:28 PM mems

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG's leadership in fusion and hybrid bonding. more

May 12, 2016 4:53 PM mems

EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

Dec 1, 2014 4:48 PM mems

SmartNIL large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. more

Oct 29, 2014 5:04 PM mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

Oct 8, 2014 4:52 PM mems

A plant for the production of electronic optical elements using MEMS technology has been launched at the Moscow Technopolis. more

Jul 10, 2014 11:01 AM mems

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. more

Jul 9, 2014 3:11 PM lasers

EV Group has unveiled the GEMINI FB XT, its next-generation fusion wafer bonding platform. more

Jul 3, 2014 3:39 PM mems

ZEISS introduces the next generation of photomask qualification system AIMS 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. more

Jun 23, 2014 2:55 PM machining

A new lithography process makes it possible to pack even more transistors on a chip. The TRUMPF Laser Amplifier delivers the high-energy pulses needed to do so. more

Aug 20, 2013 5:04 PM lasers

The Semiconductor Manufacturing Technology business group at Carl Zeiss and the German national metrology institute PTB will be expanding their cooperation in the future to include optics metrology for EUV lithography. more

Jan 15, 2013 4:53 PM metrology

The "Lithography for the 22 nanometer node" project, led by Carl Zeiss, has been successfully completed. more

Nov 6, 2012 3:11 PM mems