Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP presents a high-resolution fingerprint-sensor at SID Display Week 2017, on 23-25 May 2017 in Los Angeles/USA. more

May 8, 2017 10:26 PM electronics

When traditional chemical adhesives fail to sufficiently bond dissimilar types of materials, engineers often turn to plasma treatments to solve complex adhesion problems. more

Apr 10, 2017 12:02 PM micro manufacturing