Semiconductor wafers have gone on a diet. In certain segments of the industry, thin wafers are increasing in use in multiple devices. more

Aug 23, 2017 4:15 PM mems

Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, have announced that they have entered into a distribution agreement for North America. more

Aug 17, 2017 4:11 PM mems

In the semiconductor industry or photonics applications, components often need to be precisely positioned for each single processing step and then held in a stable position reliably. more

Jul 21, 2017 11:14 AM electronics

Semblant, the global leader in innovating and deploying protective nanomaterials in the electronics industry, has announced its latest technology, CircuitShield. more

Jul 12, 2017 4:15 PM electronics

At SEMICON West 2017, Bruker’s Semiconductor Division  today announced that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray Diffraction Imaging Systems for in-line wafer monitoring of crystalline defects. more

Jul 12, 2017 4:04 PM electronics

New business unit to expand offering of collaborative, customer-driven solutions to accelerate R&D and optimise production yields. more

Jul 10, 2017 5:12 PM electronics

Picosun Oy the National Chiao Tung University (NCTU, Taiwan), and Atom Semicon Co. Ltd. (Taiwan), have started a joint collaboration on the improvement of GaN (gallium nitride) devices with Picosun’s ALD technology. more

Jul 10, 2017 4:33 PM electronics

UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, has announced the opening of its global headquarters in Grenoble, France. more

Feb 2, 2017 10:15 AM electronics

AGC Asahi Glass (AGC) has announced it has developed a diverse line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support. more

Feb 1, 2017 11:46 PM electronics

A new class of electrostatic micro actuators developed at the Fraunhofer IPMS enables large vertical or lateral deflections with little energy consumption and low electrical drive voltage. more

Jan 19, 2017 11:36 AM mems

Plasma-Therm LLC has been selected by the ASE Group (Advanced Semiconductor Engineering Inc.) to provide plasma dicing capability at their Chung-Li, Taiwan facility. more

Jan 16, 2017 3:48 PM electronics

Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers, has expanded its production range on carriers for the handling of small semiconductor wafers as well as small substrates for various applications. more

Oct 27, 2015 3:38 PM mems

Plasma-Therm’s Advanced Vacuum division was recently selected by the University of Central Florida to provide enhanced compound semiconductor etch and dielectric deposition capabilities. more

Mar 17, 2015 4:50 PM mems

EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

Dec 1, 2014 4:48 PM mems

SmartNIL large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. more

Oct 29, 2014 5:04 PM mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

Oct 8, 2014 4:52 PM mems

New Sales and Marketing Director added to leadership team. more

Oct 2, 2014 3:49 PM mems

Actuators based on the piezo effect move heavy loads with resolutions in the sub- nanometer range and response times below one millisecond, enabling dynamic operation at high scanning frequencies. more

Sep 24, 2014 4:19 PM articles

Research and Markets has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. more

Jul 16, 2014 10:26 AM mems

LIMO steps up its engagement in the USA, aims to make laser technology a global standard. more

Jul 11, 2014 2:16 PM machining