RSS

STMicroelectronics

Will Work with Leti, STMicroelectronics and Mentor Graphics to Develop Advanced 3D Die-to-wafer Stacking Technologies Using Direct Cu-Cu Bonding Read more

mems

IRT Nanoelec and CEA-Leti, STMicroelectronics and Mentor Graphics have realised an innovative 3D chip called “3DNoC”. Read more

mems

STMicroelectronics has announced that Benedetto Vigna, Executive Vice President and General Manager of ST’s Analog, MEMS and Sensors Group, will deliver a keynote speech at the SEMICON Taiwan 2014 MEMS Forum. Read more

mems

STMicroelectronics has announced it has opened a new MEMS Microphone Lab (Anechoic Chamber) in Taiwan to test and analyse high-performance audio applications built with ST’s MEMS microphones. Read more

mems