wafer bonding

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

Nov 30, 2017 4:14 PM mems

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

Oct 3, 2017 11:14 AM mems

EVG Technology Day Event in Yokohama Highlights Process Solutions Supporting Internet of Things (IoT) Applications. more

Aug 3, 2017 12:20 PM mems

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

Jun 29, 2017 5:28 PM mems

EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers. more

Jun 23, 2017 9:10 AM mems

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG's leadership in fusion and hybrid bonding. more

May 12, 2016 4:53 PM mems

Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers, has expanded its production range on carriers for the handling of small semiconductor wafers as well as small substrates for various applications. more

Oct 27, 2015 3:38 PM mems

EV Group (EVG) has announced that it has established the NILPhotonics Competence Center. more

Dec 1, 2014 4:48 PM mems

EV Group has introduced the EVG 580 ComBond―a high-vacuum wafer bonding system. more

Oct 8, 2014 4:52 PM mems

Mitsubishi Heavy Industries has launched wafer bonding services performed using its innovative wafer bonding machines, developed in-house, capable of bonding different kind of materials at room temperature. more

Aug 12, 2014 3:54 PM mems

Research and Markets has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. more

Jul 16, 2014 10:26 AM mems

EV Group has unveiled the GEMINI FB XT, its next-generation fusion wafer bonding platform. more

Jul 3, 2014 3:39 PM mems

A year after announcing the industrialization of CEA-Leti’s M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of 6DOF MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die. more

Feb 24, 2014 4:53 PM mems

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nano technology and semiconductor markets, has announced it has installed an EVG501 wafer bonding system at Texas State University. more

Dec 4, 2012 3:23 PM mems

EV Group (EVG) a leading supplier of wafer bonding and lithography equipment for the MEMS, nano technology and semiconductor markets, announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria. more

Nov 30, 2012 11:42 AM mems