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wafer level packaging

ESCATEC shows off its LED and micro manufacturing skills at LED professional Symposium. more

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SPTS Technologies has announced that a leading Chinese wafer level packaging supplier to the electronics industry has selected the Omega fxP Etch System for through silicon via processing of 300 mm wafers for CMOS Image Sensor applications. more

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A year after announcing the industrialization of CEA-Leti’s M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of 6DOF MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die. more

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SUSS MicroTec hosted a Technology Forum in Asia that focused on the latest developments in Advanced Packaging, materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. more

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