Artificial Intelligence is reshaping data center infrastructure at an unprecedented pace. As GPU performance continues to accelerate, the challenge is no longer simply delivering more compute power. It is removing the immense amounts of heat those processors generate.
Traditional air cooling is reaching its practical limits. Today's AI servers are pushing rack power densities beyond 100 kW, with next-generation systems expected to go even higher. As a result, direct-to-chip (D2C) liquid cooling is rapidly becoming the preferred thermal management solution for hyperscalers, data center operators, and AI infrastructure providers
While much attention is focused on liquid cooling systems themselves, a critical question remains: How do you manufacture the precision thermal structures needed to unlock their full performance potential?
For Veco Precision, this is where electroforming creates a unique advantage.
read more on the Veco website