EVG GEMINI® 300-mm high-force automated production wafer bonding system. Source: EV Group.
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveils the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent bond quality and yield for MEMS devices built on larger wafers. EVG has already delivered several GEMINI systems built on the new equipment platform to multiple leading MEMS manufacturers.
MEMS manufacturers have begun to transition from 200-mm to 300-mm production lines to achieve economies of scale and meet growing market demand for MEMS devices, as well as to support new device integration schemes such as CMOS-MEMS integration, and the production of MEMS devices with larger footprint, such as ultrasonic MEMS and micromirrors. However, migrating to 300-mm wafers requires significantly higher bond forces compared to 200-mm wafers to ensure the same bond pressure over a much larger surface area.
EVG’s next-generation GEMINI system for 300-mm wafers exceeds the specifications required for 300-mm MEMS manufacturing – meeting the needs of both current and future MEMS device generations. An integrated modular HVM system for aligned wafer bonding, the GEMINI platform features up to four bond chambers with adjustable bond force (up to 350 kN), high vacuum (down to 5 x 10-6 mbar) and overpressure capability (2000 mbar abs.). It also maintains the industry-leading capabilities of the previous-generation platform, including fully automated optical alignment, full flexibility with customizable module configurations and support for a wide range of bonding processes.
“EVG has more than 30 years of experience providing production wafer bonding systems for the MEMS industry. Working closely with our customers and partners, we can see key trends and inflection points in this market very early on, and plan accordingly,” stated Dr. Thomas Glinsner, corporate technology director at EV Group. “Our next-generation GEMINI wafer bonding system is a prime example of EVG putting our long-term vision and experience into action. The result is the first wafer bonder of its kind for the MEMS industry, which helps our customers to stay on their technology roadmaps and bring innovative and exciting new MEMS devices and end-products to market.”
Product Availability
EVG is now accepting orders for the next-generation GEMINI automated production wafer bonding system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/bonding/permanent-bonding-systems/gemini.
Reference
(1) Source: Status of the MEMS Industry 2024, Yole Intelligence, June 2024