The EU-funded macQsimal project, coordinated by CSEM as part of the EU’s
FET Flagship on Quantum Technologies program, has now drawn to a close, after leading to some promising discoveries.Read more
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well asRead more
Birmingham-based photochemical etching specialist Precision Micro has announced that it will hire the largest-ever number of school leavers to its Apprenticeship Scheme this autumn.Read more
micrometal (incorporating HP Etch and Etchform) is pleased to announce the release of an animated film that focuses on the intricacies and application possibilities of photo-chemical etching (PCE)Read more
Much is made of the need for manufacturers embarking on a micro moulding project to partner with experienced and highly capable specialist micro moulders.Read more
Nanoscribe, a BICO company, will debut the Quantum X align, a new high-performance 3D printer at the Photonics West Conference and Exhibition in San Francisco.Read more
Physik Instrumente (PI) has taken a large step towards expanding their production capacities. The company has purchased an additional building close to their headquarters in Karlsruhe,Read more
AMADA WELD TECH, Inc., a leading manufacturer of welding, marking, cutting, sealing, and bonding technology equipment and systems, announces the opening of its new Eastern US Technical Center in High Point, North Carolina.Read more
micrometal GmbH (incorporating Etchform and HP Etch) has published a free on-demand webinar which explains the fundamental role that photo-chemical etchingRead more
Aerotech, the specialist for motion control and positioning systems, will be exhibiting at Micronora 2022 in Besançon from 27 to 30 September, in Hall C on stand 306.Read more
The FRITSCH A-22 NeXT Nano Laser Particle Sizer, when it comes to the highest accuracy and sensitivity even with the smallest particles - with an extra wide measuring range from 0.01 to 3800 μm.Read more
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announces it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bondingRead more
Zygo Corporation (a division of AMETEK) announces the release of Compass 2, its latest optical profiler with Diamond Turning Machine (DTM) optimization and freeform surface metrology capability.Read more