electronics
CGD Joins Forces With NXP Semiconductors to Accelerate Time to Market
Cambridge GaN Devices (CGD), a global leader in innovative GaN (Gallium Nitride)-based power devices, joins forces with NXP® Semiconductors
Jun 22, 2026
Ferroelectric Memory - Fast, Energy-Efficient Data Storage
Energy efficiency, faster processing and permanent data storage: In collaboration with GlobalFoundries, research scientists at the Fraunhofer Institute for Photonic Microsystems IPMS
Jun 12, 2026
imec presents quantum dot qubit device using High NA EUV lithography
The most advanced lithography system, crucial for future advanced memory and computer chips, will play a key role in scaling up quantum technology
May 21, 2026
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS
May 19, 2026
Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems
As the industry embarks on the transition to post quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield,
May 1, 2026
DELO Expands Medical Electronics Portfolio With Five New IBOA-Free Adhesives
DELO Industrial Adhesives has significantly expanded its medical electronics portfolio with five new IBOA- and TPO-free adhesives.
Apr 24, 2026
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials within the FAMES Pilot Line
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in
Apr 14, 2026
