electronics
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS
May 19, 2026
Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems
As the industry embarks on the transition to post quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield,
May 1, 2026
DELO Expands Medical Electronics Portfolio With Five New IBOA-Free Adhesives
DELO Industrial Adhesives has significantly expanded its medical electronics portfolio with five new IBOA- and TPO-free adhesives.
Apr 24, 2026
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials within the FAMES Pilot Line
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in
Apr 14, 2026
Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
With SuperFlash® memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing
Mar 26, 2026
New LX4580 is a Highly Integrated 24‑Channel Mixed‑Signal IC for Aviation and Defense Actuation Systems
Microchip Technology announces the LX4580, a 24‑channel mixed‑signal IC designed to streamline high‑reliability actuation control systems for aviation and defense applications.
Mar 16, 2026
Research and Innovation Factory for AI & Microelectronics – first approved module AI-DISCO begins work
The Federal Ministry of Research, Technology, and Space (BMFTR) has approved €15 million in funding for the AI-DISCO project – Edge/Cloud AI for Distributed Sensing & Computing.
Mar 12, 2026
