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wafers

Plan Optik AG expands its range of products which are available off the shelf to feature new materials. Additionally Plan Optik releases a product catalogue including all stock products with detailed information and specification. more

mems

Inseto, a leading technical distributor of equipment and materials to the microelectronic research and manufacturing sectors, has acquired IDB Technologies, a specialist supplier of semiconductor wafers and substrates. more

electronics

EVG has announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. more

electronics

The vision for the company is to provide sensing products and energy-efficient products that enhance the safety and improve the efficiency of electronic systems. more

mems

High-performance polyurethane can be engineered to produce more durable and consistent wire-cutting rollers for the production of wafers. more

electronics

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications . more

mems

EV Group (EVG) has announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. more

mems

Semiconductor wafers have gone on a diet. In certain segments of the industry, thin wafers are increasing in use in multiple devices. more

mems

EVG combines solid-state UV laser, proprietary optics, modular platform and universal debonding process to create high-throughput, low cost-of-ownership debonding process optimized for FoWLP. more

lasers

Customers rank EVG highest in trust in supplier, recommend supplier, technical leadership and quality of results in 2017 survey; company listed among "THE BEST" suppliers for 15th year in a row. more

mems

EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers. more

mems

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors. more

mems

Leading IDM selects new 4See series automated defect inspection platform for power semiconductor automotive applications. more

electronics

A new technique using liquid metals to create integrated circuits that are just atoms thick could lead to the next big advance for electronics. more

electronics