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Plasma-Therm Strengthens Presence in Europe
Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, announces its Grenoble location will serve as regional headquarters Read more
Fraunhofer IPMS Combines Latest Hardware in Microsensor and Actuator Technology with Artificial Intelligence
In everyday life, digital helpers - such as smart apps or cars that think for themselves - are already firmly integrated. Currently, however, the processing of data is mostly done on large, external servers. Read more
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as Read more