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CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as Read more
Activation on the Flow: New Process Technology for High-Tech Adhesives
With activation on the flow, DELO has developed an innovative process technology combining adhesive dispensing and preactivation in a single process step for the first time. Read more
The Power of Stillness
Researchers at the University of Liverpool are using PI actuators to precisely hold and manipulate single molecules in their research into molecular electronics. Read more