The rapidly evolving tech landscape calls for miniaturised solutions that are both innovative and cost-effective. We continue to invest in cutting-edge technology to advance our approach to microelectronics to give OEMs a definitive edge.
We have decades of experience delivering microelectronics services across several market applications, including LIDAR, TOF sensors/cameras, and high-power LED engines.
Our chip-on-board and microelectronics capabilities include:
- Die bonding
- Wire bonding
- Encapsulation
- Active alignment
Wolfgang Plank, Head of Microelectronics R&D at ESCATEC says:
“An array of factors must be considered when designing an optimised and properly working microelectronics device. One of the most important factors for robust functionality is a stable production process. This is where ESCATEC's long-term experience as an integrated EMS service provider, especially in complex assemblies, gives us a strong advantage.”
Contact us to learn more about our microelectronics services and how we help OEMs fuel their product innovation.