Universal Photonics® Incorporated (UPI), global manufacturer and distributor of critical surfacing and polishing technology, is proud to introduce SOMOS | IWT, a new merger between SOMOS – world renowned for high power Double-Sided Polishing and Lapping Machinery – and IWT Diamond Wire Saws & Compact Cutting Saws with Single or Multiple Wires. Having represented SOMOS for more than twenty years, the addition of IWT Diamond Wire Saws allows UPI to further expand its line of precision machinery, equipment and consumables specific to processing Silicon, Sapphire, Quartz, Germanium, and other hard substrates. The Diamond Wire Saw is one of the fastest saws available, with cut speeds up to 30m per second. They are available in many formats, from single wire to multiple wire cutting, in sizes starting at 100m and larger.
One of UPI’s latest installations and onsite training is for a 500mm SOMOS | IWT Diamond Wire Saw at ER Precision Optical Corporation located in Florida. Newly housed in ERPOC 22,000 sq. ft. facility, the 500mm SOMOS | IWT Diamond Wire Saw adds to ERPOC’s many outstanding capabilities processing precision optical components. In addition to polishing infrared optical blanks, the company grows germanium and silicon crystals, as well as working with many other materials, including Clear Tran, Sapphire and clear optics.
Universal Photonics’ dedication to the advancement of surfacing and polishing technology in all phases of fabrication spans nearly a century providing 9000+ products including polishes, pads and equipment. The company’s goal - to deliver the most advanced surfacing and production products available – is supported with efficient sales service, expert technical assistance and onsite training. UPI Field Application Engineers are available to discuss the requirements of any critical surfacing application.