Minimal contamination in dry plasma etching processes
Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Chemraz® G57, a perfluoroelastomer that Greene Tweed material scientists and application engineers specifically developed to meet the demands of aggressive dry plasma systems and other extremely demanding semiconductor fabrication sealing applications.
Chemraz® G57 perfluoroelastomer’s unique formulation provides enhanced plasma resistance and minimal contamination, resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz® G57 remains stable at service temperatures up to 572°F / 300°C.
Boasting nearly universal chemical compatibility, and the broadest chemical resistance of any elastomeric material, Chemraz® G57 is idea for use across a wide range of sealing applications, including endpoint windows, bell jar seals, valve seals, KF fitting seals, window seals, isolator valve seals, lid seals, gas inlet seals, slit valve seals, and chamber seals.
Greene Tweed delivers highly customizable solutions guaranteed to provide excellent performance under extremely challenging operating conditions in the semiconductor industry. Its portfolio of advanced elastomer seals and thermoplastic components are found throughout a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating).
In June 2023, Greene Tweed announced the groundbreaking of a new manufacturing facility in Korea, expanding its global production capacity of the Chemraz® FFKM product line to meet growing demand from the semiconductor industry.
For more information, contact Greene Tweed at 1.215.256.9521.